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GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE
GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE - Figura 2
GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE - Figura 3
GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE - Figura 4
GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE - Figura 5
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GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE

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GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE 

  • GPU: Boost Clock: Up to 2520 MHz
  • GPU: Game Clock: Up to 2070 MHz
  • Memory:   16GB/256 bit DDR6. 20Gbps Effective
  • Stream Processors: 3584
  • AMD RDNA™ 4 Architecture
  • Ray Accelerator: 56

78,000 L 85,000 L

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GPU AMD RADEON RX 9070 16GB SAPPHIRE PULSE 

AMD RDNA™ 4 Architecture

16GB of GDDR6 memory

AMD HYPR-RX with AFMF 2

DisplayPort™ 2.1a

AMD FidelityFX™ Super Resolution 4 with AI Upscaling

AMD Radiance Display™ Engine

AMD Fluid Motion Frames 2 technology

Honeywell PTM7950 TIM

The Honeywell PTM7950 Thermal Interface Material (TIM) offers a premium solution for high-performance electronics, particularly in the demanding field of graphics processing units (GPUs).
The PTM7950 delivers superior thermal conductivity, enhancing the reliability and longevity of graphics cards by its outstanding material characteristics.

Free Flow

The Free Flow cooling design is tailored for axial fan systems, featuring an advanced heatsink fin module that optimizes airflow paths.
By reducing turbulence and channeling air efficiently, it maximizes heat dissipation, ensuring consistent performance even under heavy thermal loads.

AeroCurve Fan Blade

The latest fan blade design builds upon its predecessor with advancements that reduce air friction, increasing the usable fan RPM range while maintaining low noise levels.
This refined design ensures improved airflow, optimized static pressure, and enhanced cooling efficiency for demanding applications.

Optimized Composite Heatpipe

The composite heatpipes are fine-tuned for each individual cooling design with optimal heat flow, efficiently and evenly spreading out the heat to the entire cooling module.

Integrated Cooling Module

Integrated Cooling is an advanced thermal management solution engineered to provide efficient heat dissipation across all critical components of a graphics card.
This innovative design ensures direct contact with the GPU, memory modules, and VRMs, delivering uniform thermal regulation. By addressing all major heat sources,
the Integrated Cooling Module helps maintain stable operating temperatures, improving overall system performance and reliability.
Ideal for demanding workloads such as gaming,
content creation, and overclocking, it ensures optimal thermal efficiency under sustained use.

Tough Metal Backplate

The all-aluminum backplate provides additional rigidity that guarantees nothing bends and dust stays out. It also helps cool your card by increasing heat dissipation.

FrameDefense

The mechanical design of the graphics card features a robust, box-like frame that ensures exceptional build quality and durability.
This solid construction provides a protective enclosure for all internal components, reducing the risk of damage during handling or installation.
This rigid frame offers added stability and strength, making it highly resistant to accidental impacts or pressure, ensuring that the delicate components, such as the GPU, memory, and VRMs, remain secure.
With this design, users can confidently handle the card without worrying about compromising its integrity or performance.

Two-Ball Bearing

These feature Dual Ball bearing fans, which have an approximately 85% longer lifespan than sleeve bearings in our tests.

The improvements to the fan blades means the solution is up to 10% quieter than the previous generation.

High TG Copper PCB

The GPU is mounted on to the high-density 12 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.

Fuse Protection

In order to protect your card, the SAPPHIRE cards have fuse protection built into the circuit of the external PCI-E power connector to keep the components safe.

Digital Power Design

SAPPHIRE PULSE AMD Radeon™ RX 9070 Series are designed with digital power which provides accurate power control and excellent power efficiency

AMD RDNA™ 4

Specifications

GPU

AMD Radeon™ RX 9070 Graphics Card
AMD RDNA™ 4 Architecture

Engine Clock

  • Boost Clock: Up to 2520 MHz
  • Game Clock: Up to 2070 MHz

 

Boost Clock is the maximum frequency achievable on the GPU running bursty workload.

Boost clock achievability, frequency, and sustainabilty will vary based on several factors, including but not limited to: thermal conditions and variation in application and workloads.

 

Game Clock is the expected GPU clock when running typical gaming applications, set to typical TGP(Total Graphics Power). Actual individual game clock results may vary.

Stream Processors

3584

Compute Units

56 CUs (3rd Gen RT + 2nd Gen AI Accelerators)

Infinity Cache

64MB

Ray Accelerators

56

AI Accelerator

112

Memory Size/Bus

16GB/256 bit GDDR6

Memory Clock

20 Gbps Effective

Displays

Maximum 4 Displays

Resolution

  • HDMI®: 7680×4320
  • DisplayPort™ 2.1a: 7680×4320

Interface

PCI-Express 5.0 x16

BIOS Support

  • UEFI

Game Index

4K

Sapphire Features

  • Honeywell PTM7950 Thermal Interface Material (TIM)
  • AeroCurve Fan Blade
  • Free Flow
  • FrameDefense
  • Integrated Cooling Module
  • Dual-X Cooling Technology
  • High TG Copper PCB
  • Optimized Composite Heatpipes
  • Metal Backplate
  • Two-Ball Bearing Fans
  • 12-Phase Digital Power Design
  • Fuse Protection
  • Intelligent Fan Control
  • Precision Fan Control
  • TriXX Supported
  • TriXX Boost

AMD Features

  • AMD RDNA™ 4 Architecture
  • 56 Compute Units (3rd Gen RT + 2nd Gen AI Accelerators)
  • AMD HYPR-RX with AFMF 2
  • AMD FidelityFX™ Super Resolution 4 with AI Upscaling
  • DisplayPort™ 2.1a
  • AMD Radiance Display™ Engine
  • AMD Fluid Motion Frames 2 technology
  • AMD Radeon™ Anti-Lag 2 technology
  • AV1 Encode/Decode
  • AMD FidelityFX™ technologies
  • Microsoft® DirectX® 12 Ultimate
  • AMD Noise Suppression
  • AMD Freesync™ technology
  • 16 GB of GDDR6 on 256-bit Memory Bus
  • AMD smart technologies
  • AMD Software: Adrenalin Edition™ application

Cooler Type

  • Dual-X Cooling
  • AeroCurve Fan Blade
  • Free Flow
  • Integrated Cooling Module
  • High TG Copper PCB
  • Optimized Composite Heatpipes
  • Two-Ball Bearing

Form Factor

2.5 slot, ATX
Dimension: 280(L)X 120.25(W)X 51.5 (H)mm

Power Consumption

220W Typical Board Power

OS

Linux®, Windows® 10, and Windows 11. 64-bit  operating system required

System Requirement

  • Minimum 650 Watt Power Supply
  • 2 x 8-pin Power Connector.
  • PCI Express® based PC is required with one X16 lane graphics slot available on the motherboard.
  • Minimum 8GB of system memory. 16GB recommended.
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