Komponente PC, RAM
RAM 16GB DDR4 3200 (2X8GB) SILICON POWER XPOWER PULSE GAMING
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RAM 16GB DDR4 3200 (2X8GB) SILICON POWER XPOWER PULSE GAMING
- Capacity 16 GB
- Type DDR4
- Speed 3200 MHz
- CL CL16
- Form Factor UDIMM
- Voltage 1.35V V
- Layout 2
- Radiaator Yes
- ECC No
6,500 L
Ka stok
RAM 16GB DDR4 3200 (2X8GB) SILICON POWER XPOWER PULSE GAMING
Technical specifications
Features
CAS latency
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module’s output pins. In general, the lower the CAS latency, the better.
16
Internal memory
A computer’s memory which is directly accessible to the CPU.
16 GB
Memory layout (modules x size)
How the overall memory of the product is put together, defined by the number of modules and the size.
2 x 8 GB
Internal memory type
The type of internal memory such as RAM, GDDR5.
DDR4
Memory clock speed
The frequency at which the memory (e.g. RAM) runs.
3200 MHz
Memory data transfer rate
3200 MT/s
Component for
What this product is used as a part of (component for).
PC
Memory form factor
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Memory voltage
The voltage (V) of the memory in the device.
1.35 V
Features
Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version
2.0
AMD Extended Profiles for Overclocking (EXPO)
Weight & dimensions
Width
The measurement or extent of something from side to side.
133.4 mm
Depth
The distance from the front to the back of something.
31.3 mm
Height
The measurement of the product from head to foot or from base to top.
5 mm
Weight
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
25 g
